is a natural material that is used for many
structural and construction purposes, as well as for furniture,
trims for other substrates, boats, and other purposes. Using
bond wood to itself provides many benefits over using fasteners,
nails or screws. Among the benefits are that loads can be more
evenly distributed throughout the structure by use of adhesives
when compared with mechanical fasteners. This allows the
structure to be built using less material to achieve
and reduces material costs. Bonding wood is different
than bonding other types of substrates in general because
the objective of bonding
is to create joints which are stronger than the wood itself.
Epoxy resin adhesives can form joints with much less strict
conditions than required to use other types of adhesives
and with bond strength exceeding the shear strength of almost
all woods. In addition, many of these other types of adhesives
chemicals than epoxy resins,
such as phenol-formaldehyde,
or urea-formaldehyde. Epoxy
resin adhesives, in particular, provide great bond strength
throughout the moisture
presented by wood from newly cut through kiln-dried and are
unimpacted by moisture both during and post-cure.
Other kinds of adhesives require moisture to cure, as high
but kiln dried lumber contains less than 8% moisture. An
additional advantage in using epoxies is that clamping or
not required to achieve a good bond
and less well prepared surfaces are readily bonded, also
reducing costs. Also epoxy adhesives generally shrink
less than other kinds of adhesives,
reducing unanticipated movement during cure and less requirement
to backfill cavities left by shrinkage.
to being bonded to itself, wood is frequently attached to
other substrates. Using adhesives for this purpose requires
the coefficient-of-expansion (COE) of each material and remain
flexible enough to withstand temperature cycling of the materials
environmental degradation from moisture and chemicals. BONDiTTM
epoxy products are
among the few available that can be used to bond wood
to substrates with other COE's for long term deployment.
Our highest recommended product for this purpose is BONDiTTM B-45TH
or B-482TH. The TH stands for thixotropic, which allows the adhesive
to be applied in most vertical applications without sagging or
running during the cure cycle.
Our recommendation would change if a fast cure is needed in which
case we recommend BONDiTTM B-536TH.
If you are looking for a hard clearcoat and sealer for wood, we
recommend BONDiTTM B-481.
Among the other substrates which wood can be bonded to using
BONDiT products are: UHMW,
Delrin, fluoropolymers, copolymers, TPE / TPR, polyethylene,
polyolefin, polypropylene, polyurethane, silicone, rubber, thermoplastics,
urethane, ceramics, glass, fiberglass, metals, stone, aggregate
To see our chart showing elongation rankings of the various
BONDiT products click here. Call or email us for advice on
for COE ratings and matching BONDiT products for your application
at (707) 284-8808 or email@example.com.