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PRIMERS, ADHESION PROMOTERS, COATINGS AND SEALANTS FOR UHMW and MOST COMBINATIONS OF SUBSTRATES

Ultra high molecular weight polyethylene (UHMW) is a tough wear-resistant plastic with low coefficient of friction, outstanding impact strength with excellent chemical and moisture resistance and broad temperature range. It is most frequently used in conveyor and bulk material handling applications.

One of the properties of UHMW that makes it difficult to bond to is the result of the manufacturing process. UHMW CAN be bonded to itself and to other substrates but it requires careful preparation and BONDiTTM brand primers or adhesion promoters, in some cases, and BONDiTTM adhesives manufactured by RELTEK LLC. BONDiTTM products are among the few available that can be used as a UHMW adhesive to bond UHWM to itself or other substrates with differing coefficients of expansion (COE). BONDiTTM products are renowned for their resistance to harsh environments and for withstanding long term deployment without debonding.

Our first product recommendation for bonding UHMW is BONDiTTM B-45 or BONDiTTM B-482.

Our recommendation would change if you are overmolding or if there are other special adhesive needs.

If overmolding, we would recommend priming the substrate with our BONDiTTM A-43 prior to using the B-45 or the B-482.

Or, if exceptional chemical resistance is desired, we would recommend the BONDiTTM B-481 or B-4811.

Among the other substrates which UHMW can be bonded to using BONDiTTM products are:
Delrin, fluoropolymers, rubber, polyethylene, polyolefin, polypropylene, polyurethane, silicone, thermoplastics, thermoset, urethane, glass, ceramics, wood, metals, stone, aggregate and concrete.

Corona or flame etch is occasionally used to prepare the edges of a proposed bond to strengthen the bond and reduce the incidence of surface chemical bloom, resulting from the manufacturing process to make UHMW. The need to pretreat the UHMW by etching occurs about 15% of the time. If you think that your application may require this treatment, please call us at (707) 284-8808 or email us at reltek@reltekllc.com for advice as this technique requires some skill and experience


Call or email us for advice on for COE ratings and matching BONDiTTM products for your application at (707) 284-8808 or reltek@reltekllc.com.

PRIMERS, ADHESION PROMOTERS, COATINGS AND SEALANTS FOR UHMW and MOST COMBINATIONS OF SUBSTRATES