BONDiT products can be used to bond stone, aggregate and/or
concrete to themselves and a wide variety of other substrates.
Among the other substrates that can be bonded to the above
materials are:
UHMW, Delrin, fluoropolymers, copolymers,
TPE / TPR, rubber, polyethylene, polyolefin, polypropylene,
polyurethane,
silicone, thermoplastics, thermoset, urethane, glass, ceramics,
wood
and metals.
Call us at (707) 284-8808 or email us at reltek@reltekllc.com.