Polypropylene
is a themoplastic, that is, it
is one of a variety of materials that have
the property of becoming hard and rigid when cooled and
are moldable when heated. Polypropylenes soften or fuse
when heated and harden and become rigid again when cooled
without
undergoing any appreciable chemical change. Polypropylenes come
in many different chemical formulae (due to additives)
which give differing chemical and mechanical properties,
including adhesion, and in various thicknesses -- both
of which affect coefficient
of expansion (COE).
Successful
long term
bonding of polypropylene to itself and to other substrates, requires
careful preparation and matching of the adhesive being used with
the differing COEs of
the substrates involved. BONDiTTM
products
are among the few available that can be used to bond polypropylene
to substrates with other COE's for harsh environments and long
term deployment without debonding.
Our
highest recommended product for bonding polypropylenes is
BONDiTTM B-45TH or B-482TH or B-4682,
depending upon the relative need for chemical resistance,
bond strength, impact and vibration resistance, heat resistance
and COE differential.
Our recommendation would change if a fast cure is needed, in which
case we recommend BONDiTTM B-536TH.
Among the other substrates to which polypropylene can be bonded
to include UHMW, Delrin, fluoropolymers,
rubber, polyethylene, polyolefin, polyurethane, silicone, thermoplastics,
thermoset, urethane, ceramics, glass, fiberglass, wood, metals, stone, aggregate
and
concrete.
To see our chart showing rankings by property, including elongation,
of the various BONDiTTM products click here.
Call or email us for advice on for COE ratings and matching BONDiTTM products
for your application
at (707) 284-8808 or reltek@reltekllc.com.