are engineered plastics that have the property of
becoming hard and rigid when cured and are moldable when
heated. Thermoplastics soften or fuse when heated and harden
and become rigid again when cooled without undergoing any
appreciable chemical change. Phenol resins and plastics were
the original synthetic thermosetting materials. Thermoplastics
can come in many different chemical formulae giving them
varying thicknesses which affect their coefficient of expansion.
Successful long term bonding of thermoplastics to themselves
and to other substrates, requires careful preparation and
matching of the adhesive being
used with the differing
COEs of the substrates involved. BONDiTTM
products are among the few available that can be used to
to substrates with differing COE's for harsh environments
and long term deployment without debonding.
Our first recommended product for bonding thermoplastics
is to apply BONDiTTM B-45
after applying an adhesion promoter such as BONDiTTM A-43
Our recommendation would change if high moisture resistance
is required, in which case we would substitute BONDiTTM A-3
as the adhesion promoter.
When molding with thermoplastic urethane (TPU), BONDiTTM A-43
can be used as an adhesion promoter.
Among the other substrates which thermoplastics be bonded
to using BONDiTTM products are: UHMW,
Delrin, fluoropolymers, polyethylene, polyolefin, polypropylene,
urethane, other thermoplastics, ceramics, glass, fiberglass, wood, metals,
stone, aggregate and
See also our discussion of Thermo
Plastic Injection Molding Procedures for Cohesive Bonds.
our chart showing elongation rankings of the various BONDiTTM
here. Call or email us for advice on
for COE ratings and matching BONDiTTM products
for your application at (707) 284-8808 or firstname.lastname@example.org.