Polyethylene
is a thermoplastic, that is, it is one of a variety of substrates
that have
the property of becoming hard and rigid when cooled and are
moldable when heated. Thermoplastics soften or fuse when heated
and harden
and become rigid again when cooled without undergoing any appreciable
chemical change. Polyethylene comes in many different
chemical and mechanical properties, including adhesion, and in
varying thicknesses -- both of which affect its
coefficient
of expansion.
Successful
long term bonding
of polyethylene to itself and to other substrates, requires careful
preparation and matching of the adhesive being used with the
differing COEs of the substrates
involved. BONDiTTM products are among
the few available that can be used to bond polyethylene to substrates
with other COE's and survive harsh environments and long deployment
without
debonding.
Our highest recommended product for this purpose is BONDiTTM B-45TH
or B-482TH or B-4682 , depending upon the relative need for chemical resistance,
bond strength, impact and vibration resistance, heat resistance and COE differential.
Our
recommendation would change if a fast cure is required, in
which case we recommend the use of BONDiTTM B-536TH.
Other recommended products are hot melt adhesives BONDiTTM HM-502
or HM-505 with adhesion promoter BONDiTTM A-43.
Among the other substrates to which polyethylene can be bonded
using BONDiTTM products are: UHMW,
Delrin, fluoropolymers, rubber, polyolefin, polypropylene,
polyurethane, silicone, thermoplastics, thermoset,
urethane, ceramics, glass, fiberglass, wood, metals, stone, aggregate
and
concrete.
To see our chart showing rankings
by property, including elongation, of the various BONDiTTM products click here. Call or email us for advice on
for COE ratings and matching BONDiTTM products for your application
at (707) 284-8808 or reltek@reltekllc.com.