Polyethylene is a thermoplastic, that is, it is one of a variety of substrates that have the property of becoming hard and rigid when cooled and are moldable when heated. Thermoplastics soften or fuse when heated and harden and become rigid again when cooled without undergoing any appreciable chemical change. Polyethylene comes in many different chemical and mechanical properties, including adhesion, and in varying thicknesses -- both of which affect its coefficient of expansion. Successful long term bonding of polyethylene to itself and to other substrates, requires careful preparation and matching of the adhesive being used with the differing COEs of the substrates involved. BONDiT^TM products are among the few available that can be used to bond polyethylene to substrates with other COE's and survive harsh environments and long deployment without debonding.

Our highest recommended product for this purpose is BONDiT^TM B-45TH or B-482TH or B-4682 , depending upon the relative need for chemical resistance, bond strength, impact and vibration resistance, heat resistance and COE differential.

Our recommendation would change if a fast cure is required, in which case we recommend the use of BONDiT^TM B-536TH.

Other recommended products are hot melt adhesives BONDiT^TM HM-502 or HM-505 with adhesion promoter BONDiT^TM A-43.

Among the other substrates to which polyethylene can be bonded using BONDiT^TM products are: UHMW, Delrin, fluoropolymers, rubber, polyolefin, polypropylene, polyurethane, silicone, thermoplastics, thermoset, urethane, ceramics, glass, fiberglass, wood, metals, stone, aggregate and concrete.

To see our chart showing rankings by property, including elongation, of the various BONDiT^TM products click here. Call or email us for advice on for COE ratings and matching BONDiT^TM products for your application at (707) 284-8808 or reltek@reltekllc.com.