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B-4682 Adhesive & Sealant

Bondable Substrates

Plastics including--UHMW, HDPE, PP, PET, PEEK, PPS, PBT, Acetal, PTFE, ETFE, PVC, PVCF, PVDF, ABS, ECTFE, polyamide and polyimides, fiberglass and composites. Elastomers including EPDM, butyl, neoprene, urethanes, and some thermoplastic elastomers (Hytrel).

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As an electrical encapsulant /sealant B-4682 offers very high shock isolation and protection of sensitive electronics from loads derived from extreme thermal cycling, (- 65°C to 150°C) as well as mechanical shock and vibration.

B-4682 handles harsh environments and is particularly effective against moisture, salt water, acids, alkalies, oils, fuels and detergents. The highly flexible (200% elongation) properties of B-4682 permits assembly of materials with extreme dissimilar thermal expansion.

B-4682 is particularly useful for assembly of low surface energy substrates such as Delrin to itself and an almost unlimited list of other materials, while offering an excellent balance between material strength, peel, shear and tensile bond strengths, chemical resistance, and environmental resistance. This product works very well as a water block sealant for cable and transducer terminations that withstands years of submersion in deep-sea and other harsh chemical environments.

Two-part epoxy, 1:1 ratio

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